Four patents currently held, every record listed here
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
The next term ends in Jul 2029. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
1
Ending by 2030
Jul 2029
Next term end
2
Patent families
When these terms end
Each bar runs from grant to computed term end. 2012 to 2042.
US 12,448,545
Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process
Jun 13, 2042
20182024203020362042
2 pending applications: term is not computable until grant.Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Only 2 of the currently held patents qualify as notable.
Notable
Ends Jul 2029 · High confidence
Also notable
Ends Jun 2042 · High confidence
Method and Device for the Injection of CMP Slurry
US 8,845,395
Renewed at every maintenance window since the 2014 grant; no more fees are due before its term ends in 2029.
Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process
US 12,448,545
Granted 2025. Too new for citation comparison; protection runs to 2042.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Sep 29, 2027The maintenance fee for Method and Device for the Injection of CMP Slurry (US 9,296,088) comes due Sep 29, 2027. Unpaid by Mar 29, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
What they patent
Grouped by real patent family, largest first, labeled by the earliest filing in each. No technology classification is inferred from titles.
| Method and Device for the Injection of CMP Slurry | 3 in force | to Nov 2031 |
| Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process | 1 in force | to Jun 2042 |
Patents held now
Soonest term end first.
Showing 1 to 4 of 4
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,845,395 | Method and Device for the Injection of CMP Slurry In force · High confidence | In force | High confidence | |
| US 8,197,306 | Method and Device for the Injection of CMP Slurry In force · High confidence | In force | High confidence | |
| US 9,296,088 | Method and Device for the Injection of CMP Slurry In force · High confidence | In force | High confidence | |
| US 12,448,545 | Silicon Carbide (SIC) Wafer Polishing with Slurry Formulation and Process In force · High confidence | In force | High confidence |
Also on record, not counted in the 4: 1 patent ended · 2 applications pending · 9 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.