46 patents currently held
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
The next term ends in Jun 2040. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
0
Ending by 2030
Jun 2040
Next term end
26
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Jun 2040 · High confidence
Also notable
Ends Mar 2042 · High confidence
Also notable
Ends Sep 2040 · High confidence
Chip-Scale Optical Interconnect Using Microleds
US 11,515,356
Cited by 19 later US patents, top 5% of utility patents granted in 2022 in our data. Protection runs to 2040.
LED Chip-To-Chip Vertically Launched Optical Communications with Optical Fiber
US 11,764,878
Cited by 18 later US patents, top 5% of utility patents granted in 2023 in our data. Protection runs to 2042.
Optical Interconnects Using Microleds
US 11,624,882
Cited by 17 later US patents, top 5% of utility patents granted in 2023 in our data. Protection runs to 2040.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 13, 2026The maintenance fee for Hybrid Integration of Microled Interconnects with Ics (US 11,677,472) comes due Dec 13, 2026. Unpaid by Jun 14, 2027, it lapses early.
- 1 fee due Feb 15, 2027The maintenance fee for Optically-Enhanced Multichip Packaging (US 11,728,894) comes due Feb 15, 2027. Unpaid by Aug 16, 2027, it lapses early.
- 1 fee due Mar 19, 2027The maintenance fee for LED Chip-To-Chip Vertically Launched Optical Communications with Optical Fiber (US 11,764,878) comes due Mar 19, 2027. Unpaid by Sep 20, 2027, it lapses early.
- 2 fees due Apr 17, 2027
- 5 fees due May 7 to 21, 2027 · next May 7
- 1 fee due Jun 5, 2027The maintenance fee for Packaging for Microleds for Chip to Chip Communication (US 11,835,758) comes due Jun 5, 2027. Unpaid by Dec 6, 2027, it lapses early.
- 3 fees due Aug 20 to 27, 2027 · next Aug 20
- 1 fee due Oct 2, 2027The maintenance fee for Bit-Wise Inverse Multiplexing for Optical Channels Utilizing Microleds (US 11,949,455) comes due Oct 2, 2027. Unpaid by Apr 3, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
What they patent
The 5 largest of its 26 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Coherent Fiber Bundle Parallel Optical Links | 4 in force | to Jun 2041 |
| Packaging for Microleds for Chip to Chip Communication | 3 in force | to Sep 2041 |
| Bit-Wise Inverse Multiplexing for Optical Channels Utilizing Microleds | 2 in force | to Jun 2042 |
| Multi-Array Parallel Optical Links | 2 in force | to May 2042 |
| LED Chip-To-Chip Vertically Launched Optical Communications with Optical Fiber | 2 in force | to Mar 2042 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 11,515,356 | Chip-Scale Optical Interconnect Using Microleds In force · High confidence | In force | High confidence | |
| US 12,074,192 | Chip-Scale Optical Interconnect Using Microleds In force · High confidence | In force | High confidence | |
| US 11,624,882 | Optical Interconnects Using Microleds In force · High confidence | In force | High confidence | |
| US 12,271,046 | Optical Interconnects Using Microleds In force · Medium confidence | In force | Medium confidence | |
| US 11,418,257 | High Speed and Multi-Contact LEDs for Data Communication In force · High confidence | In force | High confidence | |
| US 12,184,331 | High Speed and Multi-Contact LEDs for Data Communication In force · High confidence | In force | High confidence | |
| US 11,483,182 | Optical Transceiver Design for Short Distance Communication Systems Based on Microleds In force · High confidence | In force | High confidence | |
| US 11,513,285 | Packaging for Microleds for Chip to Chip Communication In force · High confidence | In force | High confidence | |
| US 11,791,896 | High Speed and Multi-Contact LEDs for Data Communication In force · High confidence | In force | High confidence | |
| US 11,835,758 | Packaging for Microleds for Chip to Chip Communication In force · High confidence | In force | High confidence |
Also on record, not counted in the 46: 31 applications pending · 2 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.