20 patents currently held
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
The next term ends in Jan 2028. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
3
Ending by 2030
Jan 2028
Next term end
19
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Dec 2037 · High confidence
Also notable
Ends Sep 2036 · High confidence
Also notable
Ends Mar 2037 · High confidence
Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device
US 11,057,996
Granted 2021. Computed term ends 2037.
Wiring Substrate and Manufacturing Method of Wiring Substrate
US 10,109,571
Granted 2018 and renewed at every maintenance window due so far. Protection runs to 2036.
Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device
US 11,317,520
The newest of the three, granted 2022. It anchors the portfolio to 2037, later than anything else here.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 18, 2026The maintenance fee for Circuit Board, Production Method of Circuit Board, and Electronic Equipment (US 10,327,340) comes due Dec 18, 2026. Unpaid by Jun 21, 2027, it lapses early.
- 1 fee due Feb 27, 2027The maintenance fee for Method of Manufacturing Board (US 10,396,020) comes due Feb 27, 2027. Unpaid by Aug 27, 2027, it lapses early.
- 1 fee due Jun 26, 2027The maintenance fee for Waveguide Member and Waveguide Layered Product (US 11,852,866) comes due Jun 26, 2027. Unpaid by Dec 27, 2027, it lapses early.
- 1 fee due Aug 25, 2027The maintenance fee for Printed Wiring Board (US 10,573,619) comes due Aug 25, 2027. Unpaid by Feb 25, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
What they patent
The 5 largest of its 19 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Production Method of Circuit Board | 2 in force | to Jun 2035 |
| Multilayer Substrate, Method for Manufacturing Multilayer Substrate, and Electronic Device | 1 in force | to Aug 2043 |
| Circuit Board with a Plurality of Laminated Insulating Layers Having Conductive Paste Filled Vias and Manufacturing Method Thereof | 1 in force | to Feb 2043 |
| Circuit Board, Method for Manufacturing Circuit Board, and Electronic Device | 1 in force | to Nov 2042 |
| Method for Manufacturing Circuit Board | 1 in force | to Aug 2042 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,943,001 | Process for Producing Multilayer Board In force · High confidence | In force | High confidence | |
| US 8,152,953 | Method of Making Printed Wiring Board and Method of Making Printed Circuit Board Unit In force · High confidence | In force | High confidence | |
| US 8,304,662 | Buildup Board, and Electronic Component and Apparatus Having the Buildup Board In force · Medium confidence | In force | Medium confidence | |
| US 8,669,481 | Laminated Circuit Board and Board Producing Method In force · High confidence | In force | High confidence | |
| US 10,327,340 | Circuit Board, Production Method of Circuit Board, and Electronic Equipment In force · High confidence | In force | High confidence | |
| US 9,769,936 | Production Method of Circuit Board In force · High confidence | In force | High confidence | |
| US 10,109,571 | Wiring Substrate and Manufacturing Method of Wiring Substrate held by FM Holdings Co., Ltd. In force · High confidence | In force | High confidence | |
| US 10,770,386 | Wiring Board, Electronic Device, and Wiring Board Manufacturing Method In force · High confidence | In force | High confidence | |
| US 11,317,520 | Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device In force · High confidence | In force | High confidence | |
| US 10,573,619 | Printed Wiring Board In force · High confidence | In force | High confidence |
Also on record, not counted in the 20: 3 patents ended · 8 applications pending · 2 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.