Intel Foundry IP LLC
100 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
188
Ending by 2030
Nov 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 42 fees due Nov 14 to 30, 2026 · next Nov 14
- 30 fees due Dec 4 to 30, 2026 · next Dec 4
- 23 fees due Jan 4 to 30, 2027 · next Jan 4
- 97 fees due Feb 1 to 28, 2027 · next Feb 1
- 90 fees due Mar 1 to 29, 2027 · next Mar 1
- 108 fees due Apr 1 to 30, 2027 · next Apr 1
- 80 fees due May 3 to 28, 2027 · next May 3
- 50 fees due Jun 3 to 30, 2027 · next Jun 3
- 84 fees due Jul 2 to 30, 2027 · next Jul 2
- 71 fees due Aug 2 to 27, 2027 · next Aug 2
- 71 fees due Sep 1 to 30, 2027 · next Sep 1
- 55 fees due Oct 2 to 30, 2027 · next Oct 2
- 36 fees due Nov 3 to 12, 2027 · next Nov 3
Recent changes
- 4 of the patents on this record were granted since Aug 16, 2026
- 71 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,471,163 | Oxide Overstress Tolerant Crystal Oscillator In force · High confidence | In force | High confidence | |
| US 7,489,033 | Electronic Assembly with Hot Spot Cooling In force · High confidence | In force | High confidence | |
| US 8,018,063 | Solder Joint Reliability in Microelectronic Packaging In force · High confidence | In force | High confidence | |
| US 8,436,470 | Solder Joint Reliability in Microelectronic Packaging In force · High confidence | In force | High confidence | |
| US 7,498,252 | Dual Layer Dielectric Stack for Microelectronics Having Thick Metal Lines In force · High confidence | In force | High confidence | |
| US 7,554,198 | Flexible Joint Methodology to Attach a Die on an Organic Substrate In force · High confidence | In force | High confidence | |
| US 7,361,044 | Socket That Engages a Pin Grid Array In force · High confidence | In force | High confidence | |
| US 8,569,812 | Floating Body Memory Cell Having Gates Favoring Different Conductivity Type Regions In force · Medium confidence | In force | Medium confidence | |
| US 9,418,997 | Floating Body Memory Cell Having Gates Favoring Different Conductivity Type Regions In force · Medium confidence | In force | Medium confidence | |
| US 9,520,399 | Floating Body Memory Cell Having Gates Favoring Different Conductivity Type Regions In force · Medium confidence | In force | Medium confidence |
Also on record, not counted in the 3,448: 100 patents in force now held by others · 90 lapsed for an unpaid fee · 6 ended at full term · 18 past the fee grace period · 1 surrendered on reissue. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.