81 patents currently held
5 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
1 more record may belong here and awaits a decision; it is not counted.
The next term ends in Dec 2026. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
33
Ending by 2030
Dec 2026
Next term end
58
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Jun 2031 · High confidence
Also notable
Ends Jan 2030 · Medium confidence
Also notable
Ends Jul 2029 · High confidence
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
US 8,388,824
Cited by 25 later US patents, top 25% of utility patents granted in 2013 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2031.
Composite Coatings for Whisker Reduction
US 8,226,807
Renewed at every maintenance window since the 2012 grant; no more fees are due before its term ends in 2030.
Chromium-Free Pickle for Plastic Surfaces
US 9,023,228
Renewed at every maintenance window since the 2015 grant; no more fees are due before its term ends in 2029.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 21, 2026The maintenance fee for Levelers for Copper Deposition in Microelectronics (US 10,294,574) comes due Nov 21, 2026. Unpaid by May 21, 2027, it lapses early.
- 1 fee due Jan 11, 2027The maintenance fee for Copper Deposition in Wafer Level Packaging of Integrated Circuits (US 11,697,884) comes due Jan 11, 2027. Unpaid by Jul 12, 2027, it lapses early.
- 1 fee due Mar 5, 2027The maintenance fee for Single Step Electrolytic Method of Filling Through Holes in Printed Circuit Boards and Other Substrates (US 11,746,433) comes due Mar 5, 2027. Unpaid by Sep 7, 2027, it lapses early.
- 1 fee due Apr 15, 2027The maintenance fee for NEAR NEUTRAL pH PICKLE ON MULTI-METALS (US 10,443,135) comes due Apr 15, 2027. Unpaid by Oct 15, 2027, it lapses early.
- 2 fees due May 3 to 7, 2027 · next May 3
- 5 fees due Jun 15 to 30, 2027 · next Jun 15
- 3 fees due Jul 16 to 28, 2027 · next Jul 16
- 1 fee due Aug 2, 2027The maintenance fee for Beta-Amino Acid Comprising Plating Formulation (US 9,249,513) comes due Aug 2, 2027. Unpaid by Feb 2, 2028, it lapses early.
- 1 fee due Nov 10, 2027The maintenance fee for Adhesion Promotion in Printed Circuit Boards (US 9,338,896) comes due Nov 10, 2027. Unpaid by May 10, 2028, it lapses early.
Recent changes
- 4 terms have ended since Aug 16, 2026
What they patent
The 5 largest of its 58 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers | 4 in force | to Jun 2031 |
| Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics | 3 in force | to Sep 2038 |
| Compositions and Methods for the Electrodeposition of Nanotwinned Copper | 2 in force | to Aug 2040 |
| Silver/Tin Electroplating Bath and Method of Using the Same | 2 in force | to Jun 2040 |
| Cobalt Chemistry for Smooth Topology | 2 in force | to Apr 2040 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,578,947 | Method for Etching Non-Conductive Substrate Surfaces In force · High confidence | In force | High confidence | |
| US RE49,202 | Copper Electrodeposition in Microelectronics In force · Low confidence | In force | Low confidence | |
| US 7,578,888 | Method for Treating Laser-Structured Plastic Surfaces In force · High confidence | In force | High confidence | |
| US 7,713,859 | Tin-Silver Solder Bumping in Electronics Manufacture In force · High confidence | In force | High confidence | |
| US 9,657,402 | Cyanide-Free Electrolyte Composition and Method for the Deposition of Silver or Silver Alloy Layers on Substrates In force · High confidence | In force | High confidence | |
| US 8,703,243 | Anti-Tarnish Coatings In force · High confidence | In force | High confidence | |
| US 8,906,217 | Composite Coatings for Whisker Reduction In force · Medium confidence | In force | Medium confidence | |
| US 9,212,427 | Cyanide-Free Electrolyte Composition, and Method for the Deposition of Silver or Silver Alloy Layers on Substrates In force · High confidence | In force | High confidence | |
| US 7,794,531 | Organic Solderability Preservative Comprising High Boiling Temperature Alcohol In force · High confidence | In force | High confidence | |
| US 8,202,431 | Method for Removing Impurities from a Metal Deposition Process Solution In force · High confidence | In force | High confidence |
Also on record, not counted in the 81: 5 patents in force now held by others · 48 patents ended · 21 applications pending · 23 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.