20 patents currently held
2 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
The next term ends in Dec 2026. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
1
Ending by 2030
Dec 2026
Next term end
18
Patent families
When these terms end
Held patents by the year their term ends
notable patents
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Feb 2039 · High confidence
Also notable
Ends Dec 2039 · High confidence
Also notable
Ends Aug 2038 · High confidence
Resin Composition
US 10,941,294
The earliest of the three still in force, granted 2021 and renewed since. Its term ends first, in 2039.
Polyimide Film and Flexible Display Device Cover Substrate Using the Same
US 11,359,093
The newest of the three, granted 2022. It anchors the portfolio to 2039, later than anything else here.
Thermally Conductive Type Polyimide Substrate
US 10,953,641
The earliest of the three still in force, granted 2021 and renewed since. Its term ends first, in 2038.
Formerly held, still cited
Notable
Ends Mar 2037 · High confidence
Granted 2018 and renewed at every maintenance window due so far. Protection runs to 2037.
now held by Microcosm Technology (Su Zhou) Co., Ltd.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Mar 10, 2027The maintenance fee for Thinned Flexible Polyimide Substrate and Method for Manufacturing the Same (US 10,412,836) comes due Mar 10, 2027. Unpaid by Sep 10, 2027, it lapses early.
- 1 fee due Jul 21, 2027The maintenance fee for Polyimide Resin, Thin Film and Method for Manufacturing Thereof (US 10,538,626) comes due Jul 21, 2027. Unpaid by Jan 21, 2028, it lapses early.
- 1 fee due Sep 10, 2027The maintenance fee for Photosensitive Polyimide Resin Composition and Method of Manufacturing Cover Film Using the Same (US 10,584,209) comes due Sep 10, 2027. Unpaid by Mar 10, 2028, it lapses early.
- 1 fee due Nov 7, 2027The maintenance fee for Polybenzoxazole Precursor and Application Thereof (US 11,976,170) comes due Nov 7, 2027. Unpaid by May 8, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
What they patent
The 5 largest of its 18 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Resin Composition | 2 in force | to Feb 2039 |
| Thinned Flexible Polyimide Substrate and Method for Manufacturing the Same | 2 in force | to Nov 2038 |
| Polyimide Film and Manufacturing Method Thereof | 1 in force | to Jan 2042 |
| Curable Composition for Inkjet, Cured Product and Flexible Printed Circuit Board | 1 in force | to Nov 2041 |
| Flexible Display Cover Substrate | 1 in force | to Jun 2040 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,374,861 | Negative Photoresist Composition In force · High confidence | In force | High confidence | |
| US 9,521,759 | Vertical Conductive Unit and Manufacturing Method Thereof In force · High confidence | In force | High confidence | |
| US 9,477,148 | Polymer, Method for Preparing the Same, and a Photosensitive Resin Composition Thereof In force · High confidence | In force | High confidence | |
| US 9,833,973 | Metal Laminate with Polyimide Resin and Method for Manufacturing the Same In force · High confidence | In force | High confidence | |
| US 10,538,626 | Polyimide Resin, Thin Film and Method for Manufacturing Thereof In force · High confidence | In force | High confidence | |
| US 10,584,209 | Photosensitive Polyimide Resin Composition and Method of Manufacturing Cover Film Using the Same In force · High confidence | In force | High confidence | |
| US 10,815,389 | Photosensitive and Via-Forming Circuit Board In force · High confidence | In force | High confidence | |
| US 10,953,641 | Thermally Conductive Type Polyimide Substrate In force · High confidence | In force | High confidence | |
| US 10,412,836 | Thinned Flexible Polyimide Substrate and Method for Manufacturing the Same In force · High confidence | In force | High confidence | |
| US 10,743,418 | Thinned Flexible Polyimide Substrate and Method for Manufacturing the Same In force · High confidence | In force | High confidence |
Also on record, not counted in the 20: 2 patents in force now held by others · 2 patents ended · 1 application pending · 20 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.