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Halogen-Free Circuitized Substrate with Reduced Thermal Expansion, Method of Making Same, Multilayered Substrate Structure Utilizing Same, and Information Handling System Utilizing

US 7,687,722 In force (reinstated)
OverviewFamilyAssignmentsSources & methods

Term ends Feb 24, 2028 · High confidence

Filed Oct 3, 2006 as application 11/541,776 · Granted Mar 30, 2010
Base term plus 509 days of patent term adjustment (USPTO delay)
Today
20 years from filing
2006 2028
Clock starts
Oct 3, 2006
Term ends
Feb 24, 2028
Granted
Mar 30, 2010
base term patent term adjustment fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
509
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
2
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 509 days past its 20-year base term on prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Oct 3, 2006, when this application, 11/541,776, was filedOct 3, 2026High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+509 days, USPTO patent term adjustment recordFeb 24, 2028High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn force (reinstated)High confidence
Computed term endThe steps above, in orderFeb 24, 2028High confidence

This family

US 7,687,722this patent
Feb 2028
Feb 2028
US 8,499,440Lapsed on the fee record
Aug 2025
Aug 2025
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Oct 3, 2006
Reel 18381, frame 938
Japp, Robert M.; Markovich, Voya R.; Papathomas, Kostas I.Endicott Interconnect Technologies, Inc.Assignment of Assignor's Interest
Dec 3, 2008
Reel 21912, frame 908
Endicott Interconnect Technologies, Inc.JPMorgan Chase Bank, N.A., as Administrative AgentSecurity Agreement
May 14, 2012
Reel 28230, frame 611
JPMorgan Chase Bank, N.A., as Administrative AgentEndicott Interconnect Technologies, Inc.Release by Secured Party
May 14, 2012
Reel 28230, frame 798
Endicott Interconnect Technologies, Inc.; Ei Transportation Company LLC; Endicott Medtech, Inc.Pnc Bank, National AssociationSecurity Agreement
Mar 6, 2013
Reel 29938, frame 823
Pnc Bank, National AssociationIntegrian Holdings, LLCAssignment of Security Agreement
May 6, 2013
Reel 30359, frame 57
Endicott Interconnect Technologies, Inc.; Ei Transportation Company LLC; Endicott Medtech, Inc.; Integrian Holdings, LLCM&T BankSecurity Agreement
Jun 12, 2013
Reel 30599, frame 918
Endicott Interconnect Technologies, Inc.Maines, William; Maines, DavidSecurity Agreement
Jun 12, 2013
reel/frame not recorded
Endicott Interconnect Technologies, Inc.Maines, WilliamSecurity Agreement
Jun 12, 2013
reel/frame not recorded
Endicott Interconnect Technologies, Inc.Maines, DavidSecurity Agreement
Feb 26, 2015
Reel 35098, frame 968
Maines, William; Maines, DavidEndicott Interconnect Technologies, Inc.Release of Security Interest
Apr 16, 2015
Reel 35442, frame 569
Endicott Interconnect Technologies, Inc.I3 Electronics, Inc.Assignment of Assignor's Interest
Nov 14, 2016
Reel 40608, frame 626
I3 Electronics, Inc.M&T BankSecurity Interest
Jul 15, 2019
Reel 49758, frame 265
I3 Electronics, Inc.TTM Technologies North America, LLCAssignment of Assignor's Interest
May 30, 2023
Reel 63804, frame 702
Telephonics Corporation; TTM Technologies, Inc.; TTM Technologies North America, LLCJPMorgan Chase Bank, N.A., as Administrative AgentPatent Security Agreement (ABL)
May 30, 2023
Reel 63804, frame 745
Telephonics Corporation; TTM Technologies, Inc.; TTM Technologies North America, LLCJPMorgan Chase Bank, N.A., as Administrative AgentPatent Security Agreement (TERM Loan)
Jun 2, 2026
Reel 75843, frame 247
TTM Technologies, Inc.; TTM Technologies North America, LLC; Telephonics CorporationJPMorgan Chase Bank, N.A., as Administrative AgentSecurity Interest
Jun 2, 2026
Reel 75679, frame 852
JPMorgan Chase Bank, N.A., as Administrative AgentTelephonics Corporation; TTM Technologies, Inc.; TTM Technologies North America, LLCRelease of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
reel/frame not recorded
JPMorgan Chase Bank, N.A., as Administrative AgentTelephonics CorporationRelease of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
reel/frame not recorded
JPMorgan Chase Bank, N.A., as Administrative AgentTTM Technologies, Inc.Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
reel/frame not recorded
JPMorgan Chase Bank, N.A., as Administrative AgentTTM Technologies North America, LLCRelease of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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