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US

Bonding Tool for Mounting Semiconductor Chips

US 7,958,628 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Oct 29, 2024 · Medium confidence

Why Medium: A parent in the chain could not be resolved.

Filed Dec 10, 2009 as application 12/635,536 · Granted Jun 14, 2011
Base term, 20 years from filing
Today
20 years from filing
Term ended Oct 29, 2024
2004 2026
Clock starts
Oct 29, 2004
Term ended
Oct 29, 2024
Granted
Jun 14, 2011
base term after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
2
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees were paid, so no fee lapse ended it. Confidence: Medium. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Oct 29, 2004, when application 10/977,047, the earliest non-provisional in its chain, was filed (this one was filed Dec 10, 2009); a parent in its chain could not be resolved (the next row)Oct 29, 2024High confidence
Continuity chainA parent in the chain could not be resolveddated from this application's own claimMedium confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidterm endedHigh confidence
Computed term endThe steps above, in orderOct 29, 2024Medium confidence

This family

US 7,650,688In force
Dec 2026
Dec 2026
US 7,958,628this patent
Oct 2024
Oct 2024
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 7, 2016
Reel 38378, frame 343
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Jun 11, 2020
Reel 52907, frame 650
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Aug 30, 2023
Reel 64783, frame 896
Stats ChipPAC Ltd.Stats ChipPAC Pte.Lte.Correct Error in Assignment Name from Stats Chippac Pte. LTE. to Stats Chippac Pte. LTD. (REEL: 038378 Frame: 0292)
Sep 14, 2023
Reel 64962, frame 123
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the Assignee's Name on Coversheet from Stats Chippac Pte. LTE. to Stats Chippac Pte. LTD. Previously Recorded on Reel 038378 Frame 0292. Assignor(S) Hereby Confirms the Change of Name.
Sep 22, 2023
Reel 65015, frame 917
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the Assignee's Name on Cover Sheet from Stats Chippac Pte. LTE. to Stats Chippac Pte. LTD. Previously Recorded on Reel 064783 Frame 0896. Assignor(S) Hereby Confirms the Corrective Change of Name.

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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