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Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

US 8,004,095 In force
OverviewFamilyAssignmentsSources & methods

Term ends Dec 14, 2027 · High confidence

Filed Jun 23, 2010 as application 12/822,080 · Granted Aug 23, 2011
Base term, 20 years from filing
Today
20 years from filing
2007 2027
Clock starts
Dec 14, 2007
Term ends
Dec 14, 2027
Granted
Aug 23, 2011
base term fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
19
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Dec 14, 2007, when application 11/957,101, the earliest non-provisional in its chain, was filed (this one was filed Jun 23, 2010)Dec 14, 2027High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderDec 14, 2027High confidence

This family

US 7,767,496In force
Jan 2028
Jan 2028
US 8,343,809In force
Jan 2031
Jan 2031
US 9,318,441In force
Jan 2029
Jan 2029
US 8,004,095this patent
Dec 2027
Dec 2027
US 8,183,095In force
Feb 2031
Feb 2031
US 9,252,066In force
Jun 2029
Jun 2029
US 8,456,002In force
Dec 2027
Dec 2027
US 8,907,476In force
Feb 2031
Feb 2031
8 of 19 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 7, 2016
Reel 38378, frame 352
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Jun 11, 2020
Reel 52907, frame 650
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Aug 31, 2023
Reel 64913, frame 352
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0301. Assignor(S) Hereby Confirms the Change of Name.

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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