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Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps

US 8,193,034 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Nov 10, 2026 · Medium confidence

Why Medium: A parent in the chain could not be resolved.

Filed Jun 26, 2009 as application 12/492,360 · Granted Jun 5, 2012
Base term, 20 years from filing
Today
20 years from filing
Term ended Nov 10, 2026
2006 2026
Clock starts
Nov 10, 2006
Term ended
Nov 10, 2026
Granted
Jun 5, 2012
base term after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
9
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees were paid, so no fee lapse ended it. Confidence: Medium. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Nov 10, 2006, when application 11/595,638, the earliest non-provisional in its chain, was filed (this one was filed Jun 26, 2009); a parent in its chain could not be resolved (the next row)Nov 10, 2026High confidence
Continuity chainA parent in the chain could not be resolveddated from this application's own claimMedium confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidterm endedHigh confidence
Computed term endThe steps above, in orderNov 10, 2026Medium confidence

This family

US 8,174,119In force
Apr 2029
Apr 2029
US 8,133,762In force
Sep 2029
Sep 2029
US 8,193,034this patent
Nov 2026
Nov 2026
US 8,742,579In force
Aug 2029
Aug 2029
US 8,525,337Term ended
Nov 2026
Nov 2026
US 9,263,361Term ended
Nov 2026
Nov 2026
US 9,385,074Term ended
no later than Nov 2026
no later than Nov 2026
US 9,640,504In force
May 2029
May 2029
8 of 9 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Jul 10, 2009
Reel 22941, frame 129
Pagaila, Reza A.; Do, Byung Tai; Huang, Shaungwu; Pendse, Rajendra D.Stats ChipPAC, Ltd.Assignment of Assignor's Interest
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 8, 2016
Reel 38388, frame 36
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Jun 8, 2020
Reel 52864, frame 57
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Jun 8, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Jun 8, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Aug 31, 2023
Reel 64789, frame 885
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Correct Error in Assignment Name from Stats Chippac Pte. LTE. to Stats Chippac Pte. LTD. (REEL: 38388 Frame: 0036
Sep 7, 2023
Reel 64834, frame 911
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct a Typographical Error on the Cover Sheet Previously Recorded at Reel: 038388 Frame: 0036. Assignor(S) Hereby Confirms the Change of Name.
Sep 7, 2023
Reel 64836, frame 363
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct a Typographical Error on the Cover Sheet Previously Recorded at Reel: 064789 Frame: 0885. Assignor(S) Hereby Confirms the Corrective Assignment.

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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