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Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro via Array for 3-D Fo-Wlcsp

US 8,592,992 In force
OverviewFamilyAssignmentsSources & methods

Term ends Feb 21, 2032 · High confidence

Filed Dec 14, 2011 as application 13/326,128 · Granted Nov 26, 2013
Base term plus 69 days of patent term adjustment (USPTO delay)
Today
20 years from filing
2011 2032
Clock starts
Dec 14, 2011
Term ends
Feb 21, 2032
Granted
Nov 26, 2013
base term patent term adjustment fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
69
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
11
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 69 days past its 20-year base term on prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Dec 14, 2011, when this application, 13/326,128, was filedDec 14, 2031High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+69 days, USPTO patent term adjustment recordFeb 21, 2032High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderFeb 21, 2032High confidence

This family

US 7,642,128In force
Dec 2028
Dec 2028
US 8,796,846In force
May 2031
May 2031
US 9,082,806In force
Jan 2029
Jan 2029
US 8,592,992this patent
Feb 2032
Feb 2032
US 9,293,401In force
Dec 2028
Dec 2028
US 9,064,936In force
Dec 2028
Dec 2028
US 8,994,185In force
Dec 2031
Dec 2031
US 9,401,331In force
Dec 2028
Dec 2028
8 of 11 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Dec 14, 2011
Reel 27383, frame 411
Lin, Yaojian; Chen, KangStats ChipPAC, Ltd.Assignment of Assignor's Interest
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 7, 2016
Reel 38378, frame 418
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Dec 13, 2019
Reel 51285, frame 318
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Dec 13, 2019
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Dec 13, 2019
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Dec 18, 2019
Reel 51365, frame 680
Stats ChipPAC Pte. Ltd.Jcet Semiconductor (Shaoxing) Co., Ltd.Assignment of Assignor's Interest
Jun 17, 2020
Reel 53511, frame 298
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Jun 17, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Jun 17, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Sep 1, 2023
Reel 64803, frame 300
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. LTE>" to "Stats Chippac Pte. Ltd" Previously Recorded at Reel: 038378 Frame: 0219. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
Reel 64908, frame 920
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the Assignee's Name on Coversheet from "Stats Chippac Pte. LTE." to "Stats Chippac Pte. Ltd." Previously Recorded on Reel 038378 Frame 0418. Assignor(S) Hereby Confirms the Change of Name.

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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