The Patent Finder
US

Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

US 9,252,066 In force
OverviewFamilyAssignmentsSources & methods

Term ends Jun 17, 2029 · High confidence

Filed Aug 11, 2011 as application 13/207,633 · Granted Feb 2, 2016
USPTO first gave this application the number US 8,900,920 and withdrew it before it issued. That number now leads here.
Base term plus 551 days of patent term adjustment (USPTO delay)
Today
20 years from filing
2007 2029
Clock starts
Dec 14, 2007
Term ends
Jun 17, 2029
Granted
Feb 2, 2016
base term patent term adjustment fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
551
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
2 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
19
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 551 days past its 20-year base term on prosecution delay. 2 of 3 maintenance fees are paid so far. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Dec 14, 2007, when application 11/957,101, the earliest non-provisional in its chain, was filed (this one was filed Aug 11, 2011)Dec 14, 2027High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+551 days, USPTO patent term adjustment recordJun 17, 2029High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events2 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderJun 17, 2029High confidence

This family

US 7,767,496In force
Jan 2028
Jan 2028
US 8,343,809In force
Jan 2031
Jan 2031
US 9,318,441In force
Jan 2029
Jan 2029
US 8,004,095In force
Dec 2027
Dec 2027
US 8,183,095In force
Feb 2031
Feb 2031
US 9,252,066this patent
Jun 2029
Jun 2029
US 8,456,002In force
Dec 2027
Dec 2027
US 8,907,476In force
Feb 2031
Feb 2031
8 of 19 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Apr 7, 2016
Reel 38378, frame 382
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Sep 6, 2023
Reel 64869, frame 363
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.This Submission Is to Correct a Typographical Error in the Cover Sheet Previously Recorded on Reel: 038378 Frame: 0382 to Correct the Spelling of Assignee's Name from "Stats Chippac Pte. LTE." to "Stats Chippac Pte. Ltd."

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

The Patent Finder CompaniesExpirationsCalculatorWatchlistPricing MethodologyCorrectionsLegalPrivacysupport@thepatentfinder.com Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) Part of 137 Finder · © 2026 137 Finder LLC · Sources cited