234 patents currently held
1,191 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
358 more records may belong here and await a decision; they are not counted.
The next term ends in Nov 2026. from the record
Of the 1,191 now held by other companies, 501 name Stats ChipPAC Pte Lte as their current owner, and 690 more name another party. Each row says which.
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
53
Ending by 2030
Nov 2026
Next term end
189
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Apr 2029 · High confidence
Also notable
Ends Mar 2030 · High confidence
Also notable
Ends May 2027 · High confidence
Semiconductor Package with Embedded Die
US 8,174,119
Cited by 114 later US patents, top 5% of utility patents granted in 2012 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2029.
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
US 9,548,240
Cited by 34 later US patents, top 10% of utility patents granted in 2017 in our data, and renewed at every maintenance window due so far. Protection runs to 2030.
Semiconductor Package Having Through-Hole via on Saw Streets Formed with Partial Saw
US 7,585,750
Cited by 77 later US patents, top 10% of utility patents granted in 2009 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2027.
Formerly held, still cited
Notable
Ends Dec 2028 · High confidence
Cited by 203 later US patents, top 5% of utility patents granted in 2015 in our data, and renewed at every maintenance window due so far. Protection runs to 2028.
now held by Stats ChipPAC Pte. Ltd.
Also notable
Ends Mar 2032 · High confidence
Cited by 136 later US patents, top 5% of utility patents granted in 2018 in our data, and renewed at every maintenance window due so far. Protection runs to 2032.
now held by Stats ChipPAC Pte. Lte.
Also notable
Ends Sep 2029 · High confidence
Cited by 156 later US patents, top 5% of utility patents granted in 2012 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2029.
now held by Stats ChipPAC Pte. Lte.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 4 fees due Nov 21 to 28, 2026 · next Nov 21
- 6 fees due Dec 2 to 27, 2026 · next Dec 2
- 2 fees due Jan 7 to 28, 2027 · next Jan 7
- 1 fee due Feb 20, 2027The maintenance fee for Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits (US 10,388,612) comes due Feb 20, 2027. Unpaid by Aug 20, 2027, it lapses early.
- 5 fees due Mar 1 to 29, 2027 · next Mar 1
- 1 fee due Apr 15, 2027The maintenance fee for Semiconductor Device and Method of Forming a Pop Device with Embedded Vertical Interconnect Units (US 10,446,479) comes due Apr 15, 2027. Unpaid by Oct 15, 2027, it lapses early.
- 5 fees due May 3 to 17, 2027 · next May 3
- 4 fees due Jun 1 to 24, 2027 · next Jun 1
- 1 fee due Jul 12, 2027The maintenance fee for Integrated Circuit Packaging System with a Substrate Embedded Dummy-Die Paddle and Method of Manufacture Thereof (US 9,236,278) comes due Jul 12, 2027. Unpaid by Jan 12, 2028, it lapses early.
- 2 fees due Sep 22 to 29, 2027 · next Sep 22
- 8 fees due Oct 5 to 28, 2027 · next Oct 5
- 1 fee due Nov 3, 2027The maintenance fee for Integrated Circuit Packaging System with Pre-Molded Leadframe and Method of Manufacture Thereof (US 9,331,003) comes due Nov 3, 2027. Unpaid by May 3, 2028, it lapses early.
Recent changes
- 18 of the patents on this record were granted since Aug 16, 2026
- 24 terms have ended since Aug 16, 2026
What they patent
The 5 largest of its 189 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP | 6 in force | to Nov 2033 |
| Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages | 6 in force | to Sep 2033 |
| Antenna In Embedded Wafer-Level Ball-Grid Array Package | 5 in force | to Jul 2036 |
| Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package | 5 in force | to Jun 2036 |
| Semiconductor Device and Method of Forming MEMS Package | 3 in force | to Jan 2036 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,518,224 | Offset Integrated Circuit Package-On-Package Stacking System held by Stats ChipPAC Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 8,115,301 | Methods for Manufacturing Thermally Enhanced Flip-Chip Ball Grid Arrays In force · High confidence | In force | High confidence | |
| US 7,557,432 | Thermally Enhanced Power Semiconductor Package System held by Stats ChipPAC Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 7,608,921 | Multi-Layer Semiconductor Package In force · High confidence | In force | High confidence | |
| US 7,598,600 | Stackable Power Semiconductor Package System held by Stats ChipPAC Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 7,622,325 | Integrated Circuit Package System Including High-Density Small Footprint System-In-Package held by Stats ChipPAC Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 7,650,688 | Bonding Tool for Mounting Semiconductor Chips In force · High confidence | In force | High confidence | |
| US 7,498,665 | Integrated Circuit Leadless Package System held by Stats ChipPAC Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 7,550,828 | Leadframe Package for MEMS Microphone Assembly In force · High confidence | In force | High confidence | |
| US 7,612,444 | Semiconductor Package with Flow Controller In force · High confidence | In force | High confidence |
Also on record, not counted in the 234: 1,191 patents in force now held by others · 260 patents ended · 174 applications pending · 109 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.