The Patent Finder
US

Semiconductor Package Having Through-Hole via on Saw Streets Formed with Partial Saw

US 7,585,750 In force
OverviewFamilyAssignmentsSources & methods

Also listed on Stats ChipPAC, Ltd., an earlier holder on the record. The recorded assignments below show how it moved.

Term ends May 4, 2027 · High confidence

Filed Sep 25, 2007 as application 11/861,233 · Granted Sep 8, 2009
Base term, 20 years from filing
Today
20 years from filing
2007 2027
Clock starts
May 4, 2007
Term ends
May 4, 2027
Granted
Sep 8, 2009
base term fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
17
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts May 4, 2007, when application 11/744,657, the earliest non-provisional in its chain, was filed (this one was filed Sep 25, 2007)May 4, 2027High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderMay 4, 2027High confidence

This family

US 7,569,421In force
Dec 2027
Dec 2027
US 8,445,325In force
Dec 2027
Dec 2027
US 7,723,159In force
May 2027
May 2027
US 7,750,452In force
Jul 2027
Jul 2027
US 7,585,750this patent
May 2027
May 2027
US 7,829,998In force
Feb 2028
Feb 2028
US 7,902,638In force
Feb 2029
Feb 2029
US 7,960,841In force
Jun 2027
Jun 2027
8 of 17 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Sep 25, 2007
Reel 19876, frame 394
Do, Byung Tai; Kuan, Heap Hoe; Chua, Linda Pei EeStats ChipPAC, Ltd.Assignment of Assignor's Interest
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 7, 2016
Reel 38378, frame 319
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Dec 13, 2019
Reel 51285, frame 318
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Dec 13, 2019
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Dec 13, 2019
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Dec 18, 2019
Reel 51365, frame 680
Stats ChipPAC Pte. Ltd.Jcet Semiconductor (Shaoxing) Co., Ltd.Assignment of Assignor's Interest
Aug 30, 2023
Reel 64760, frame 986
Stats ChipPAC Pte. Lte.Stats ChipPAC Pte. Ltd.Correct Error in Assignment Name from Stats Chippac, Pte. LTE to Stats Chippac Pte. LTD (REEL: 038378 Frame: 0319)

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

The Patent Finder CompaniesExpirationsCalculatorWatchlistPricing MethodologyCorrectionsLegalPrivacysupport@thepatentfinder.com Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) Part of 137 Finder · © 2026 137 Finder LLC · Sources cited